industrial x ray systems
"
Elettronica BGA AX8200 della macchina di ispezione di Unicomp X Ray a semiconduttore di SME
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Macchina di raggi x di Unicom di elettronica per rilevazione di difetto sulle superfici del wafer a semiconduttore
EMS Semiconductor Unicomp PCB X Ray Machine for Electronics BGA AX8200 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is
La grande ispezione mette in scena la macchina del PWB X Ray, Super Sensitive dell'attrezzatura di ispezione dei raggi x
Large inspection stages PCB X Ray Machine with high quality X-ray images Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, Other Special Industries. Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 90kV/100kV Max.Power 8W Spot Size 5μm X-ray
Macchina in tempo reale del PWB X Ray di immagine, attrezzatura elettronica AX8500 di ispezione
Electronic and electrical components PCB X Ray Machine AX8500 The AX8500 X Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt
Macchina per ispezione a raggi X composita elettronica a bassissima radiazione con imaging CT doppio UNCT2600 UNICOMP
Dual CT Imaging Ultra Low Radiation Electronics Composite X-ray Inspection Machine UNCT2600 UNICOMP Product Description: UNCT2600 is a high-precision compact industrial CT system, engineered for multi-specification and multi-material workpiece inspection to meet sophisticated nondestructive testing demands across diverse industries. It is widely applicable to precision inspection of small metal castings, non-ferrous metals, lithium battery cells, semiconductor chips,
Macchina di raggi x di rendimento elevato AX9100 per il tasso di riempimento di saldatura di SMT PTH e l'ispezione vuota di BGA
High Performace X-ray Machine AX9100 for SMT PTH soldering filling rate and BGA Void inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
Applicazione dei raggi x vicini del tubo di 5μm per ispezionare la cellula ricaricabile del bottone del litio di elettronica portabile
Applying 5μm close tube X-ray to inspect Wearable Electronics rechargeable Lithium button cell Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
L'ispezione interna di qualità della struttura del cavo del chipset da Unicomp 5um ha chiuso il tubo AX7900 X Ray Machine
Chipset Lead frame Inner Quality Inspection by Unicomp 5um closed tube AX7900 X Ray Machine Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm
Rifornimento della fabbrica di Unicomp 90KV del sistema di ispezione dei raggi x di microfocus 2.5D per Chip Inner Defect Inspection
Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
