industrial x ray systems
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Il sistema di ispezione dei raggi x di Unicomp riduce il rischio di contaminazione dei corpi estranei
Unicomp X-ray inspection system reduces risk of foreign matter contamination Unicomp X-ray inspection system scans for contaminants and checks for foreign bodies in dry bulk powders, baking and snack products, cereal and crackers. It detects and automatically rejects contaminants, including glass shards, metal fragments, mineral stone, and some plastic and rubber compounds. The system includes software that collects data that can be stored centrally and used with optional
Sistema di immagine di matrice del rivelatore di 40-120KV Unicomp X Ray Automatic Rejection Food Linear
Unicomp UNF6040 X-ray inspection system is designed for the automatic inspection of online Food, Pet Food and Pharmaceutical. The innovative “no curtain” design combined with hygienic construction makes Unicomp UNF6041 for easy and efficient cleaning where daily sanitation of equipment is mandatory. Specifiction: Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1
Macchina di raggi x di Unicomp AX8200Max 90kv 5um per il cavo di IC che spazza prove rotte delle crepe
Unicomp AX8200Max 90kv 5um X-ray machine for IC wire sweeping broken cracks testing Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
5 macchina di raggi x chiusa del tubo 90kv del micro Unicomp AX8200Max per prova del leadframe del semicon
5 micro closed tube 90kv X-ray machine Unicomp AX8200Max for semicon leadframe testing Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
La macchina industriale di Unicomp UNCT2000 CT per l'ispezione delle crepe dell'alloggio della batteria dei veicoli elettrici
High resolution industrial CT machine Unicomp UNCT2000 for electric vehicles battery cell housing cracks inspection Function Application: Equipment Features: Powerful Function: DR and CT dual system, Tomography, 3D rebulid and analysing. High Safety: Multiple safety protection measurements, meets all the international safety standards. User Friendly: User friendly system, easy operation. High Precision Inspection: High-precision mechanical transmission system, advanced image
AX9100max Macchina elettronica a raggi X con segni fissi durante l'inclinazione FPD
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Unicomp AX8300MAX 110KV Ispezione a raggi X per crepe interne nei componenti ceramici
Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task
Ispezione a raggi X Unicomp 110KV per rilevamento di vuoti MOSFET e analisi di affidabilità AX8300MAX
Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task
Rilevazione e sistemi di ispezione eccellenti di operabilità X Ray dei materiali estranei dell'alimento degli argomenti
Food X-Ray Detection and Inspection Systems for Foreign Matters Features: Excellent operability: Automatically save product images, convenient for later analysis. Adapt to multiple product inspection: Pallets, bags, boxes, bottles, cans, loose products etc. High specification hardware configuration: The components of the equipment are imported brands to ensure the performance and service life of the whole machine. Easy to disassemble and clean: Easier integration of existing
