industrial x ray systems
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UNX 4015 Sistema a raggi X per caramelle di gamberetti, caramelle di verdura, gnocchi di pollame
UNX 4015 X-ray system for Prawn candy vegetable poultry dumplings foreign matters detection APPLICATION UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Provide High precision automatic foreign detection, It can effectively identify metal, ceramic, glass, bone,
Clear Imaging BGA Void Detection PCBA BGA Raggi X AX9600 Unicomp SMT Sistema di ispezione dell'assemblaggio PCB
Clear Imaging BGA Void Detection PCBA BGA X-ray AX9600 Unicomp SMT PCB Assembly Inspection System UNICOMP AX9600 adopts an in-house developed 160kV high-power open micro-focus X-ray tube with an ultra-fine 0.8μm focal spot. It supports magnification up to 2000× and offers superior X-ray penetration, enabling precise void content measurement for TVS diodes. Optimized for high-end semiconductor inspection, it caters to high-precision quality control of advanced IC packaging,
90kv macchina a raggi X ad alta risoluzione Unicomp AX7900 con tubo 5um per la curvatura dei fili di legame BGA
90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location
Macchina di raggi x di alta risoluzione AX8200MAX per ispezione interna di difetti del chip di Semicon
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
Raggi x della Cina Unicomp 90KV con il sistema di ispezione di HD PFD per la rilevazione di difetti del chipset
China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
Unicomp UNCT3200 Sistema CT 3D ad alta risoluzione 450KV per pale motore Analisi porosità getti
Unicomp UNCT3200 High-Resolution 450KV 3D CT System for engine blades Castings porosity analysis NDT Quality Inspection For Precision Turbine Blade Porosity Analysis Product Specifications Attribute Value Maximum tube voltage 450kV Focal size (EN 12543) d=0.4mm/d=1.0mm Maximum detected weight 100kg Imaging area ≤430mm×430mm Product Overview The UNCT3200 industrial CT testing machine features a vertical twin-column design with a high-precision, solid marble base. Equipped with
Unicomp UNX6030N Macchina di ispezione alimentare a raggi X a carico pesante per il latte di soia in polvere a livello impermeabile IP66
Unicomp UNX6030N heavy load X ray food inspection machine for soybean milk powder in IP66 waterproof level APPLICATION The UNX6030-N is employed for detecting contaminants in the form of foreign matter within small packages containing lightweight products, including candies, fresh meat, prawns, vegetables, poultry, chocolates, pastries, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, and more. FEATURES Easy to Operate: one button start&stop,
Macchina per l'ispezione dei raggi X elettronica del giunto di saldatura BGA inclinabile AX8300MAX Unicomp Analisi automatica del vuoto
Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional
Unicomp UNCT3200 Sistema di tomografia tridimensionale ad alta risoluzione 450KV per l'analisi della porosità delle pale del motore
Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Product Overview UNCT3200 is a self-shielded, multi-purpose industrial CT computed tomography system designed to accommodate workpieces of various sizes and materials. This system meets industrial CT application demands across diverse industries and is specially engineered for high-precision inspection of medium and large products, including metal castings, non
