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Qualità SMT BGA che salda la macchina di raggi x vuota di misura Microfocus 130kV Fabbrica

SMT BGA che salda la macchina di raggi x vuota di misura Microfocus 130kV

130kV 7 μm Microfovus X-Ray Machine For SMT BGA Soldering Void Measurement​ Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One

Qualità Tabella obliqua di rotazione di vista 360 di elettronica X Ray Machine With FPD di AX9100 130kV Microfocus Fabbrica

Tabella obliqua di rotazione di vista 360 di elettronica X Ray Machine With FPD di AX9100 130kV Microfocus

AX9100 130kV microfocus X-ray with FPD oblique view and 360°rotation table for electronic components check Features of ​Unicomp AX9100: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications of ​Unicomp AX9100: ● SMT, BGA, CSP, Flip

Qualità vista obliqua della metropolitana AX9100 Unicomp X Ray Machine FPD di fine 5um per ispezione di IC Semicon Fabbrica

vista obliqua della metropolitana AX9100 Unicomp X Ray Machine FPD di fine 5um per ispezione di IC Semicon

Unicomp 5μm close tube AX9100 X-ray machine with FPD oblique view for IC Semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualità Ispezione legante di spazzata di elettronica X Ray Machine For Semiconductor Wire di AX9100 130kV Fabbrica

Ispezione legante di spazzata di elettronica X Ray Machine For Semiconductor Wire di AX9100 130kV

High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualità Metropolitana di fine di AX9100 Unicomp X Ray Machine 130kV per PCBA BGA QFN che salda controllo vuoto Fabbrica

Metropolitana di fine di AX9100 Unicomp X Ray Machine 130kV per PCBA BGA QFN che salda controllo vuoto

130kV maintenance free close tube X-ray machine Unicomp AX9100 For PCBA BGA QFN soldering Void check Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualità Macchina a raggi X Unicomp AX9180 180kV Microfocus Electronics con FPD Obliqua Fabbrica

Macchina a raggi X Unicomp AX9180 180kV Microfocus Electronics con FPD Obliqua

Unicomp AX9180: raggi X microfocus da 180 kV con dimensione spot di 10 μm, inclinazione di 60° e collegamento a 7 assi. L'FPD ad alta risoluzione offre un ingrandimento 1000X per un'ispezione precisa di PCB, BGA e semiconduttori. Include 1 anno di garanzia e programmazione offline.

Qualità Macchina a raggi X per PCB ad alte ingrandimenti Unicomp AX9100MAX per l'ispezione dei fili di legame dei componenti elettronici di IC Fabbrica

Macchina a raggi X per PCB ad alte ingrandimenti Unicomp AX9100MAX per l'ispezione dei fili di legame dei componenti elettronici di IC

High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery

Qualità Ispezione bassa di ripartizione 225KV NDT X Ray Machine Automotive Aircraft Vessel Fabbrica

Ispezione bassa di ripartizione 225KV NDT X Ray Machine Automotive Aircraft Vessel

Unicomp X ray NDT Machine Automotive Aircraft Vessel Inspection Systems UNC225π Features: ● High reliable and long life,low breakdown ● High definition and resolution FPD ● C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend) ● Multi-functional workstation,360°rotation and shift ● User friendly software design for easy interfacing can facilitate,customized software ● High penetration,Voltage up to 225KV,Maximum penetration thickness up

Qualità Macchina di alta risoluzione del PWB X Ray Fabbrica

Macchina di alta risoluzione del PWB X Ray

Electronics PCB parts X ray Machine with a high-resolution imaging chain X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight