x ray inspection system
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Sistema SMD X Ray Chip Counter 1.1kW del ERP con la bobina di nastro 4
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
Monitor LCD del tunnel di Unicomp SMD PCBA X Ray Chip Counter 440mm
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
Misura offline di AX8200Max SMT SME X Ray Machine Auto Mapping
Offline AX8200Max SMT EMS X Ray Machine Auto Mapping Measurement Unicomp offline AX8200Max X-ray with auto-mapping and measurement for BGA QFN LED soldering Void Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot
SMT PCB X-Ray Machine Alta risoluzione Micron Focus Spot Dimensione Unicomp AX7900 Per il controllo della qualità e delle crepe all'interno del cellulare
SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection Description of IC X Ray machine AX7900: It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others. FEATURES of IC Xray
Unicomp AX7900 High Specifications 2D 2.5D X-Ray Machine per l'ispezione dei cellulari e il controllo delle crepe
High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking Description of IC X Ray machine AX7900: It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, small-scale metal casting, electronic connector modules, cables, aerospace components, as well as the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A
Rivelatore di matrice lineare di ispezione di Unicomp X Ray Machine PCBA BGA di rilevazione di SMT SME
High Resolution Digital SMT EMS Detection X Ray Machine PCBA / BGA Inspection Linear Array Detector Specifications Operation System Windows Operation System 22" LCD Monitor Keyboard and Mouse X-Ray Machine Dimensions:1080(W)X1180(D)X1730(H) Packing Size:1420*1420*2000mm Weight: 1150KG Magnification:600X Power Requirements:220VAC 50Hz Temperature/Humidity:0℃～ 40℃ / 30 ～ 70RH Power Consuption(Max):0.5KW X-Ray Tube Voltage : 100KV Max Current: 200 μA Focal Spot Size: 5 micron
100kV 1uSv/h X Ray Detection Machine 1.0KW per la saldatura del LED
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel X-Ray tube & Detector motion up and down, friendly user interface and fast target point
LED che salda 1kW 90KV X Ray Detection Equipment 24"
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
illuminazione di 1kW 1uSv/H 90KV X Ray Scanning Machine For LED
Application It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip detection; It can also be applied to BGA, CSP, Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module components, package testing, photovoltaic industry, battery industry, etc. Features Sµm closed X-Ray tube, HD digital flat panel Max. loading area 1300 x 650mm, Max. inspection area 1300 x 700mm ;600x Magnification
