Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Proprietà di base
Luogo di origine:
Cina
Marchio:
UNICOMP
Certificazione:
CE, FDA
Numero di modello:
AX9100max
Proprietà Commerciali
Quantità minima di ordine:
1 set
Prezzo:
can negotiate
Termini di pagamento:
L/C, T/T
Capacità di fornitura:
100set/montrh
Riepilogo Prodotto
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...
Dettagli del prodotto
Evidenziare:
Unicomp AX9100max X-ray inspection system
,Flip-Chip BGA X-ray machine
,FCBGA packaging analysis equipment
Monitor:
Display da 27" HD
System OS:
Windows10 a 64 bit
Hard Disk:
1TB
RAM:
16g
CPU Model:
I7
Descrizione del prodotto
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including:
- BGA/CSP/Flip Chip packaging
- LED & optoelectronic components
- Fuse & diode manufacturing
- PCB & semiconductor assembly
- Battery production
- Small metal castings
- Electronic connector modules & cables
- Photovoltaic (PV) cell inspection
Application Fields
Application fields of Unicomp AX9100max X-ray Machine
Functions and Features
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Sample inspection image from Unicomp AX9100max X-ray Machine
Technical Parameters and Specifications
Technical specifications of Unicomp AX9100max X-ray Machine
Dimensions and Appearance
Dimensions and appearance of Unicomp AX9100max X-ray Machine
Rating complessivo
cinque stelle
100%
4 stelle
0
3 stelle
0
2 stelle
0
1 stella
0
Tutte le recensioni
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TIt's useful for our product.
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JGood!
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SStable product quality , reliable cooperation partner
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