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Auto Void Detection Xray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment Unicomp

Proprietà di base
Luogo di origine: Cina
Marchio: UNICOMP
Certificazione: CE, FDA
Numero di modello: AX8300
Proprietà Commerciali
Quantità minima di ordine: 1 set
Prezzo: can negotiate
Termini di pagamento: T/T, L/C
Capacità di fornitura: 30 set al mese
Riepilogo Prodotto
Auto Void Detection X-ray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment by Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring ...

Dettagli del prodotto

Evidenziare:

Auto Void Detection Xray Machine

,

BGA Solder Joint Testing Equipment

,

High Motion Precision Xray Machine

Product Name: AX8300
Dimension: 1215*1325*1700(millimetro)
Power Supply: 220V,50Hz/60Hz 4A
Weight: 1350 kg
Voltage: 110kV
Warranty: 1 anno
Descrizione del prodotto
Auto Void Detection X-ray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment by Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to
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    United States Jan 21.2026
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