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130KV 3D CT X-ray System for BGA Internal Structure Inspection Unicomp AX9100VS

Proprietà di base
Luogo di origine: Cina
Marchio: Unicomp
Certificazione: CE
Numero di modello: AX9100vs
Proprietà Commerciali
Quantità minima di ordine: 1 pz
Prezzo: can negotiate
Termini di pagamento: T/T, L/C
Capacità di fornitura: 30 set al mese
Riepilogo Prodotto
130KV 3D CT X-ray System for BGA Internal Structure Inspection Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die ...

Dettagli del prodotto

Evidenziare:

130KV 3D CT X-ray system

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BGA internal structure inspection X-ray

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Unicomp AX9100VS X-ray machine

Name: Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus Sistema di ispezione di analisi a raggi X
Footprint: 1400 ((L) × 1720 ((W) × 1800 ((H) mm
Machine Weight: 2925 kg
Power: 4,5KW
Descrizione del prodotto
130KV 3D CT X-ray System for BGA Internal Structure Inspection Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die Casting, Molded Plastic Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized 7-axis
Rating complessivo
5.0
★★★★★
★★★★★
Sulla base di 50 recensioni recenti
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    United States Jan 21.2026
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