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Semiconductor AX8300MAX Unicomp QFN Internal Void Defect Analyzer

Proprietà di base
Luogo di origine: Cina
Marchio: UNICOMP
Certificazione: CE, FDA
Numero di modello: AX8300MAX
Proprietà Commerciali
Quantità minima di ordine: 1 set
Prezzo: can negotiate
Termini di pagamento: T/T, L/C
Capacità di fornitura: 30 set al mese
Riepilogo Prodotto
Semiconductor AX8300MAX Unicomp QFN Internal Void Defect Analyzer Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive ...

Dettagli del prodotto

Evidenziare:

Semiconductor AX8300MAX X-ray analyzer

,

QFN internal void defect detector

,

Electronics X-ray machine with warranty

Motion Control Mode: Mouse, tastiera e joystick
Tilt And Rotation: Inclinazione unilaterale del rilevatore massimo 60°
Monitor: Display da 27"HD4K
System OS: Windows11 a 64 bit
Power Consumption: 900 W.
Descrizione del prodotto
Semiconductor AX8300MAX Unicomp QFN Internal Void Defect Analyzer Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional
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    United States Jan 21.2026
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