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High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp

Proprietà di base
Luogo di origine: Cina
Marchio: UNICOMP
Certificazione: CE, FDA
Numero di modello: AX9500
Proprietà Commerciali
Quantità minima di ordine: 1 set
Prezzo: can negotiate
Termini di pagamento: T/T, L/C
Capacità di fornitura: 300 set al mese
Riepilogo Prodotto
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and ...

Dettagli del prodotto

Evidenziare:

FPD SMT X-ray inspection machine

,

BGA packaging X-ray machine

,

Unicomp AX9500 X-ray inspection

Name: Macchina di ispezione dei raggi x di Unicomp
Application: SMT, SME, BGA, elettronica, CSP, LED, Flip Chip, semiconduttore
Industry: Industria elettronica
X-Ray Leakage: < 1uSv="">
Descrizione del prodotto
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (planar CT + cone beam CT). Applications Semiconductor industry SMT
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