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Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester

Proprietà di base
Luogo di origine: Cina
Marchio: UNICOMP
Certificazione: CE, FDA
Numero di modello: AX9500
Proprietà Commerciali
Quantità minima di ordine: 1 set
Prezzo: can negotiate
Termini di pagamento: T/T, L/C
Capacità di fornitura: 300 set al mese
Riepilogo Prodotto
Multi-mode 3D Reconstruction PCBA BGA Solder Joint X-ray Inspection Machine AX9500 Unicomp Inspection Tester High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Product Overview Fully upgraded new products featuring advanced CT detection ...

Dettagli del prodotto

Evidenziare:

Multi-mode 3D X-ray inspection machine

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BGA solder joint X-ray tester

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PCBA X-ray inspection machine with warranty

Name: Macchina di ispezione dei raggi x di Unicomp
Application: SMT, SME, BGA, elettronica, CSP, LED, Flip Chip, semiconduttore
Industry: Industria elettronica
X-Ray Leakage: < 1uSv="">
Descrizione del prodotto
Multi-mode 3D Reconstruction PCBA BGA Solder Joint X-ray Inspection Machine AX9500 Unicomp Inspection Tester High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Product Overview Fully upgraded new products featuring advanced CT detection capabilities for BGA, CSP, flip chips, LEDs and other semiconductors. Ideal for SMT welding analysis with comprehensive 3D tomography CT scanning system (planar CT + cone beam CT).
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