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110KV X-ray Inspection for BGA with AI-Powered Automatic Void Detection Unicomp AX8300MAX

Proprietà di base
Luogo di origine: Cina
Marchio: UNICOMP
Certificazione: CE, FDA
Numero di modello: AX8300MAX
Proprietà Commerciali
Quantità minima di ordine: 1 set
Prezzo: can negotiate
Termini di pagamento: T/T, L/C
Capacità di fornitura: 30 set al mese
Riepilogo Prodotto
UNICOMP AX8300MAX X-ray Inspection System Advanced 110KV industrial X-ray inspection system with AI-powered automatic void detection, specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...

Dettagli del prodotto

Evidenziare:

110KV X-ray BGA inspection machine

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AI-powered automatic void detection X-ray

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Unicomp AX8300MAX X-ray electronics

Model: AX8300MAX
Motion Control Mode: Mouse, tastiera e joystick
Tilt And Rotation: Inclinazione unilaterale del rilevatore massimo 60°
Monitor: Display da 27"HD4K
System OS: Windows11 a 64 bit
Power Consumption: 900 W.
Tube Type: Sigillato
Descrizione del prodotto
UNICOMP AX8300MAX X-ray Inspection System Advanced 110KV industrial X-ray inspection system with AI-powered automatic void detection, specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic
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