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Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection

Proprietà di base
Luogo di origine: Cina
Marchio: UNICOMP
Certificazione: CE, FDA
Numero di modello: AX8300MAX
Proprietà Commerciali
Quantità minima di ordine: 1 set
Prezzo: can negotiate
Termini di pagamento: T/T, L/C
Capacità di fornitura: 30 set al mese
Riepilogo Prodotto
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable ...

Dettagli del prodotto

Evidenziare:

Unicomp AX8300MAX X-ray inspection machine

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BGA automated void detection X-ray

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110KV X-ray machine for electronics

Motion Control Mode: Mouse, tastiera e joystick
Tilt And Rotation: Inclinazione unilaterale del rilevatore massimo 60°
Monitor: Display da 27"HD4K
System OS: Windows11 a 64 bit
Power Consumption: 900 W.
Descrizione del prodotto
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and
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