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Macchina di elettronica X Ray

Qualità Unicomp AX9100max Macchina a raggi X 130kV 65W PER BGA Fabbrica

Unicomp AX9100max Macchina a raggi X 130kV 65W PER BGA

Unicomp AX9100max X-ray Machine 130kV 65W FOR BGA The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, ...
Qualità Unicomp AX9100max macchina a raggi X per celle cilindriche Fabbrica

Unicomp AX9100max macchina a raggi X per celle cilindriche

Unicomp AX9100max X-ray Machine For Cylindrical Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image ...
Qualità Unicomp AX9100max macchina a raggi X 130kV 65W per l'ispezione IGBT Fabbrica

Unicomp AX9100max macchina a raggi X 130kV 65W per l'ispezione IGBT

Unicomp AX9100max X-ray Machine For IGBT The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and ...
Qualità Macchina a raggi X Unicomp AX9100max 220V 50Hz per Tin Climbing Fabbrica

Macchina a raggi X Unicomp AX9100max 220V 50Hz per Tin Climbing

Unicomp AX9100max X-ray Machine For Tin Climbing The Unicomp AX9100max X-ray Machine is specifically designed for tin climbing applications, offering advanced inspection capabilities for various industries. Application Fields Widely applied for: BGA, CSP, Flip Chip LED, Fuse, Diode PCB, Semiconducto...
Qualità Macchina a raggi X Unicomp AX9100max 2400 kg per l'ispezione dei tubi MOS Fabbrica

Macchina a raggi X Unicomp AX9100max 2400 kg per l'ispezione dei tubi MOS

Unicomp X-ray AX9100max For Internal Defect Inspection Of MOS Tube Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection ...
Qualità Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus Sistema di ispezione di analisi a raggi X Fabbrica

Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus Sistema di ispezione di analisi a raggi X

Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny ...
Qualità Fonti 100KV di alto potere X Ray della macchina di elettronica X Ray del PWB SMT BGA LED Fabbrica

Fonti 100KV di alto potere X Ray della macchina di elettronica X Ray del PWB SMT BGA LED

PCB , SMT , BGA , LED Electronics X Ray Machine high power x-ray sources X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon ...
Qualità Alte specifiche schede elettroniche 2D e 2.5D macchina a raggi X Unicomp AX9100MAX con 360 gradi tavola di rotazione per BGA e PCB ispezione Fabbrica

Alte specifiche schede elettroniche 2D e 2.5D macchina a raggi X Unicomp AX9100MAX con 360 gradi tavola di rotazione per BGA e PCB ispezione

It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature ...
Qualità SMT PCB X-Ray Machine Unicomp AX9100MAX Alta risoluzione Micron Focus Spot Dimensione per BGA Voids e Paste di saldatura ispezione Fabbrica

SMT PCB X-Ray Machine Unicomp AX9100MAX Alta risoluzione Micron Focus Spot Dimensione per BGA Voids e Paste di saldatura ispezione

It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary ...