bga x ray inspection system
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Manipolatore massimo di asse 5um 6 di Microfocus 2.5D Unicomp X Ray AX8200 per elettronica
Unicomp AX8200Max 5um microfocus 2.5D X Ray Machine with 6 Axis Manipulator For Automotive electronics quality checking Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3.
Metropolitana vicina Unicomp X Ray AX8200 5μM massimi For Automotive Electronics
Using Unicomp AX8200Max close tube Microfocus X-ray to detect Automotive electronics inner quality defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control,
Dimensione del punto di messa a fuoco micron della macchina a raggi X SMT PCB per la misurazione dei vuoti BGA e l'ispezione dell'altezza di arrampicata della saldatura
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
SMT PCB X-Ray Machine Unicomp AX9100MAX Alta risoluzione Micron Focus Spot Dimensione per BGA Voids e Paste di saldatura ispezione
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
Macchina di raggi x di Unicomp AX8200Max 90kv 5um per il cavo di IC che spazza prove rotte delle crepe
Unicomp AX8200Max 90kv 5um X-ray machine for IC wire sweeping broken cracks testing Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
5 macchina di raggi x chiusa del tubo 90kv del micro Unicomp AX8200Max per prova del leadframe del semicon
5 micro closed tube 90kv X-ray machine Unicomp AX8200Max for semicon leadframe testing Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
SMT 1kW 90KV BGA Viods X Ray Detecting Equipment
Features • Multi-function DXI image processing system, CNC programmable detection • Multi-function workstation with ±60° tilt and X-Y multi-axis movement • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • X-ray tube & detector automatic lifting and descending, with convenient target point positioning system • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification X-ray Images Item Description Specifications X-Ray
Controllo automatico CNC programmabile Macchina elettronica a raggi X Unicomp AX7900 con angolo di inclinazione di 60° Per l'ispezione telefonica usata
CNC programable automatic inspection Electronics X-ray machine Unicomp AX7900 with tilting angle 60°for used phone inspection Description of IC X Ray machine AX7900: It is broadly utilized in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpoint
Sicurezza - rivelatore solo orientato del raggio della batteria al litio X del supporto di progettazione con l'immagine di alta risoluzione
Safety-oriented design Stand alone Lithium Battery X-ray Detector with high resolution image The lithium battery X-Ray detection equipment of multiple types and full automation solely-developed by Unicomp Technology is targetted to inspect cells alignment metric and tabs soldering quality . It improves automation as well as gains high-definition internal images by means of X-ray imaging technology . This technology is widely applied to the detection of lithium battery in
