bga x ray machine
"
Sistema di ispezione 3D X Ray Offline CT Unicomp AX9500 per ispezione strati PCB
3D X-Ray computed temography offline CT Inspection system unicomp AX9500 for PCB layers inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum die-casting
Analisi di guasto del sistema di ispezione AX8500 di Unicomp X Ray del Governo di SMT di elettronica
Electronics SMT Cabinet Unicomp X-Ray Inspection System AX8500 Failure Analysis Features: ● 100KV 5μm X-Ray tube. ● FPD Detector. ● Real-time image. ● 1000X system magnification. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. ● Modular design with In-line expansibility. ● Economical and Practical. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
Raggi x AX9100 di microfocus di Unicomp 130kV per Led PCBA che salda misura vuota
Unicomp 130kV microfocus X-ray AX9100 for Led PCBA soldering Void measurement Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery
Macchina fotografica Unicomp X Ray 130kV di HD per l'ispezione dei bordi di PCBA
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
Sistema di collegamento online di asse di ADR X Ray Inspection Equipment FPD 6 della striscia del LED
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Modular design with In-line expansibility. ● Economical and Practical. ● Real-time image. ● 1000X system magnification. ● 100KV 5μm X-Ray tube. ● FPD Detector. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
Striscia di Unicomp X Ray LED di rilevazione del difetto vuoto/di qualità che salda per l'industria elettronica
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Modular design with In-line expansibility. ● Economical and Practical. ● 100KV 5μm X-Ray tube. ● FPD Detector. ● Real-time image. ● 1000X system magnification. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● Aluminum Die Casting, Moulding Plastic. ● Ceramics, Other Special Industries. ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor
CNC 160KV NDT X Ray Equipment BGA per le parti fondenti del ferro
Wheel Hub / Rim Casting Parts Quality Control By Unicomp High Penertration UNC160 X-Ray System Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● Multi-functional workstation,360°rotation and shift; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development requirement. System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment
Macchina di raggi x di alta risoluzione AX8200MAX per ispezione interna di difetti del chip di Semicon
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
Rivelatore online 130kv di ADR X Ray Inspection Equipment FPD della striscia ad alta velocità del LED
Unicomp High Speed inline SMT PCBA X-Ray Inspection System with Automotive Identification OK / NG Result Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
