electronics x ray system
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5 micron Alta risoluzione 90kv X Ray Machine Unicomp AX7900 con tubo di cinque micron per PCBA Testing
5 micron high resolution 90kv X ray machine Unicomp AX7900 with five micron tube for PCBA testing Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming
Unicomp UNCT3100 Raggi X per parti di motori di automobili
Unicomp UNCT3100 X-Ray for Automobile engine parts Product Description: The UNCT3100 is a compact industrial CT inspection system that boasts high precision and can be utilized in various industries to fulfill their unique inspection needs. It is mainly used for inspecting small metal castings, non-ferrous metals, lithium battery cells, chips, electronic parts, rock specimens, cores, soils, fossils, composite materials, biological specimens, and other detection purposes.
PTH ad alta precisione per assemblaggio di PCB attraverso buchi AX7900 Unicomp Alta stabilità
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
90kv macchina a raggi X ad alta risoluzione Unicomp AX7900 con tubo 5um per la curvatura dei fili di legame BGA
90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location
Modulo front-end automobilistico NDT CT UNCT2600
Automotive Front End Module NDT CT UNCT2600 Product Description: UNCT2600 is a highly sophisticated, compact industrial CT inspection system that can be used in a variety of sizes with materials, to meet the high precision inspection needs of different industries. Mainly used in small metal castings and colored metal, lithium new energy battery cells, chips, electronic devices, rock samples, core, soil, chemical stone, composite materials, biological samples, etc. Features:
Ispezione di qualità NDT del sistema di tomografia computerizzata industriale 225KV 3D Unicomp UNCT2600
Unicomp UNCT2600 Industrial 225KV 3D Computed Tomography System NDT Quality Inspection Product Description: UNCT2600 is a highly sophisticated, compact industrial CT inspection system that can be used in a variety of sizes with materials, to meet the high precision inspection needs of different industries. Mainly used in small metal castings and colored metal, lithium new energy battery cells, chips, electronic devices, rock samples, core, soil, chemical stone, composite
Unicomp 180kV Microfocus sorgente a raggi X per IGBT substrato / modulo
Unicomp 180kV Microfocus X-ray Source For IGBT substrate / module Description of 180kV Microfocus X-ray Source : UNMS-U180B is a closed tube 180 kV Microfocus X-Ray Source using hot cathode technology, digital control and 100% domestic raw materials. It has the advantages of small focal spot size, high magnification, stable X-Ray emission, higher output power and strong penetration ability. The high voltage, control circuit and cooling unit are properly arranged within a
Macchina di raggi x di alta risoluzione AX8200MAX per ispezione interna di difetti del chip di Semicon
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
Raggi x della Cina Unicomp 90KV con il sistema di ispezione di HD PFD per la rilevazione di difetti del chipset
China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
