industrial inspection systems
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FDA 0.8KW X Ray Inspection Machine FPD per la batteria al litio
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
CSP LED 5um X Ray Inspection Machine Microfocus AX8200 con il tracciato di CNC
Unicomp 5um Microfocus AX8200 X Ray Inspection Machine For Automotive Electronics quality control with CNC mapping Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB
Unicomp AX8200MAX X Ray Inspection Equipment For Semiconductor
Unicomp AX8200 X Ray Inspection Equipment For Semiconductor Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable)
Attrezzatura di saldatura di ispezione di NDT di vuoto di elettronica X Ray Machine BGA QFN LED del PWB di SME SMT
Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Application Fields of X Ray Machine AX8200Max SMT/PCBA Inspection Semiconductor Inspection Lithium Batteries Inspection LED Inspection Photovoltaic
Macchina di ispezione Unicomp AX8200max X Ray per l'ispezione dei difetti del cablaggio elettrico
Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Technical Specifications of BGA Xray machine AX8200max System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC
Macchina industriale di ispezione di Unicomp NDT X Ray per il fuso a snodo della direzione/parti di saldatura/fusioni
Industrial X ray Unicomp NDT inspection machine UNZ225 for steering knuckle welding parts and castings porosity inspection The UNZ series is one of Unicomp Technology most popular models for aluminum casting, aerospace components and steel pipe. It offers an excellent balance of power and space sensitivity. The system can handle products up to 120cm in size while seated nicely in your failure analysis lab or busy production line. SYSTEM CAPABILITIES Advanced 2D X-ray
Macchina per l'ispezione a raggi X a batteria al litio Unicomp Alta risoluzione AX8200B 130kV Tubo Micron sigillato
Unicomp 5um 90kV sealed tube X-Ray Inspection Machine AX8200B for button Lithium battery inspection Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process
Unicomp Desktop X-ray system CX3000 per l'ispezione dei difetti interni dei componenti elettronici
Compact size Electronics X Ray Machine with moving wheels CX3000 Application of SMT X-Ray machine BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photovoltaic Industry, Other Special Industries. FEATURES of Desktop X-ray machine 1. Super Compack and Desk-top Design 2. Multi-function X-Ray Inspection 3. Different Inspection Mode 4. Portable with Wheels 5. Status Light and Emergency Button 6.
Busta di alimenti confezionati ispezione a raggi X Unicomp UNX 4015-D
Bag packaged food X ray inspection Unicomp UNX 4015-DProduct Description:Our state-of-the-art X-ray contaminant detection system for bagged foods has transformed quality assurance practices, encompassing instant meals, frozen goods, fresh-cut produce, and snack items. By effortlessly piercing through packaging barriers, it promptly detects any unwanted substances, reinforcing food safety standards and regulatory compliance. Its seamless incorporation into manufacturing lines,
