real time x ray system
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Schede elettroniche 2D e 2.5D Macchina a raggi X AX9100MAX con tavola di rotazione a 360 gradi per BGA&PCB
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Macchina a raggi X per PCB ad alte ingrandimenti Unicomp AX9100MAX per l'ispezione dei fili di legame dei componenti elettronici di IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
Misurazione della curvatura IC Unicomp AX9100MAX Macchina a raggi X con dimensione di pixel di 84 μm e angolo di inclinazione di 60°
It is widely utilized in applications such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, Photovoltaic Industry, and more. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray
SMT PCB X-Ray Machine Unicomp AX9100MAX Alta risoluzione Micron Focus Spot Dimensione per BGA Voids e Paste di saldatura ispezione
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
130KV Micron Focus Spot Size Tube X-Ray Machine Unicomp AX9100 Modello aggiornato AX9100MAX con doppi computer per l'ispezione PCB&BGA
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
Alte specifiche schede elettroniche 2D e 2.5D macchina a raggi X Unicomp AX9100MAX con 360 gradi tavola di rotazione per BGA e PCB ispezione
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
la pietra ceramica dell'analizzatore della macchina di rilevazione dell'alimento 80KV e della bevanda X Ray può imbottigliare il succo del barattolo
Metal foreign Materials Ceramic Stone X Ray detection Machine Scanner Application: Food security: all kinds of meat, seafood, fruits and vegetables, additive, milk, chocolate and other foreigh matter inside the test. Foreigh body include: metal, glass, ceramic, stone, bone, plastic. Foreign body checking luggage, handbags, toys, shoes, clothing, hardware accessories, electronic components, such as : product quality testing. Features: Easy to operate with mouse and keyboard Hi
AX9100max Macchina elettronica a raggi X con segni fissi durante l'inclinazione FPD
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Stabilità di operazione della macchina 130KV di ispezione di X Ray di densità bassa delle fonderie 2d
130KV Foundries Low Density Industrial 2D X-ray Inspection Systems 1. High resolution, subtle defect recognition ability to upgrade with the imported 5um micro focus source 2. Save the detection time of the bulk of the work piece via the CNC programmable control 3. No dead angle detection with C-arm five-axis motion detection mechanism 4. Servo stepper motor drive to make the operation stability 5. Voltage regulator, isolation, filtering, grounding and other protective
