bga inspection equipment
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Macchina di ispezione del raggio di Unicomp AX7900 90kV X per ispezione di saldatura di qualità di IC di vuoto di SMT BGA
Unicomp AX7900 90kV X ray inspection machine for SMT BGA soldering void IC quality inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
Sistema di ispezione 130KV CSP LED AX9100, 1900kg dei raggi x di SMT BGA di elettronica
Electronics SMT BGA X-ray Detection Equipment 130KV CSP LED AX9100 Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● 7 axis linkage, 70 degree tilt detection. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ●
Macchina a raggi X Unicomp AX7900 per EMS SMT PCBA BGA QFN CSP
CE FDA compliance x ray machine Unicomp AX7900 for EMS SMT PCBA BGA QFN CSP soldering Void checking Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
Unicomp 90kV 5um ha chiuso l'elettronica X Ray Machine For SMT PCBA BGA della metropolitana
Unicomp 90kV 5um Closed Tube Electronics X Ray Machine For SMT PCBA BGA Unicomp 90kV 5um closed tube CX3000 X-ray Inspection System for SMT PCBA BGA QFN LED soldering void inspection Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution
Sistema di rappresentazione della metropolitana FPD di Unicomp AX7900 Digital X Ray Machine 90kV per SMT SME BGA
Unicomp AX7900 X-ray with 90kV Tube and FPD imaging system with automatic SMT BGA measurement per IPC 610 Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
BGA offline da tavolino X Ray Machine 5um per ispezione delle componenti di elettronica
Desktop Offline BGA X-Ray Machine 5um For Electronics Components Inspection OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to support you.
AX7900 25 gradi che inclinano elettronica X Ray Machine For BGA CSP Flip Chip Inspection
AX7900 with function of tilting ±25° for better inspection effect Description of IC X Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm
raggi x di 5μm Microfocus con FPD 55° che inclina vista per ispezionare vuoto di saldatura di PCBA BGA QFN LED
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
Rifornimento della fabbrica di Unicomp 90KV del sistema di ispezione dei raggi x di microfocus 2.5D per Chip Inner Defect Inspection
Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
