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Qualità Veicolo che accende moto di ribaltamento di Unicomp X Ray 60° con la funzione di CNC Fabbrica

Veicolo che accende moto di ribaltamento di Unicomp X Ray 60° con la funzione di CNC

EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework

Qualità BGA QFN Unicomp X Ray Inspection System 130KV con un movimento di 6 assi Fabbrica

BGA QFN Unicomp X Ray Inspection System 130KV con un movimento di 6 assi

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

Qualità Elettronica X Ray Machine 1.3kW di HD FPD per i chip di Semicon IC Fabbrica

Elettronica X Ray Machine 1.3kW di HD FPD per i chip di Semicon IC

HD FPD Electronics X Ray Machine 1.3kW For Semicon IC Chips Microfocus X Ray machine with HD FPD for semicon IC chips wire sweep broken defect Inspection Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm

Qualità fabbricazione di alta risoluzione della fabbrica di 5um X Ray Equipment For Electric Switch Unicomp Fabbrica

fabbricazione di alta risoluzione della fabbrica di 5um X Ray Equipment For Electric Switch Unicomp

Unicomp Factory Manufacturing 5μm High Resolution X-ray Equipment for Electric Switch Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 80kV/90kV Max.Power 12W/8W Spot Size 5μm/15μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 160 X/360X Detection Region Max.Loading Size 440mm x 400mm Max.Inspection Area 420mm

Qualità Macchina di raggi x di Unicom di elettronica per rilevazione di difetto sulle superfici del wafer a semiconduttore Fabbrica

Macchina di raggi x di Unicom di elettronica per rilevazione di difetto sulle superfici del wafer a semiconduttore

EMS Semiconductor Unicomp PCB X Ray Machine for Electronics BGA AX8200​ X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is

Qualità Raggi x di Unicomp AX8500 110kV 5um 2.5D per il controllo di saldatura di qualità di SMT PCBA BGA IC di elettronica Fabbrica

Raggi x di Unicomp AX8500 110kV 5um 2.5D per il controllo di saldatura di qualità di SMT PCBA BGA IC di elettronica

Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

Qualità L'ispezione interna di qualità della struttura del cavo del chipset da Unicomp 5um ha chiuso il tubo AX7900 X Ray Machine Fabbrica

L'ispezione interna di qualità della struttura del cavo del chipset da Unicomp 5um ha chiuso il tubo AX7900 X Ray Machine

Chipset Lead frame Inner Quality Inspection by Unicomp 5um closed tube AX7900 X Ray Machine Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm

Qualità Elettronica Unicomp X Ray Equipment di rilevazione AX7900 di qualità del cablaggio del cavo Fabbrica

Elettronica Unicomp X Ray Equipment di rilevazione AX7900 di qualità del cablaggio del cavo

Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading

Qualità Macchina 1080mmx1180mmx1730mm di ispezione del PWB X Ray di Microfocus Unicomp Fabbrica

Macchina 1080mmx1180mmx1730mm di ispezione del PWB X Ray di Microfocus Unicomp

Unicomp X-ray Machine Electronics LED BGA Standard Multipurpose Features: ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera. ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y programming function for multiple image inspection routines ● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification. BGA void/area auto