bga x ray inspection system
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Unicomp Mirofocus X Ray Machine CX3000 per la saldatura di BGA CSP QFN PCBA
CX3000 Benchtop Electronics X-ray Machine Small Unit for Checking LED CSP Phone OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to support
Micro fuoco di alta risoluzione AX9100 del rivelatore X Ray Pcb Inspection Machine 130KV
High Resolution Detector X Ray Pcb Inspection Machine 130KV Micro Focus AX9100 Using Micro Focus X-ray AX9100 with High Resolution Image Detector to detect Micro or Mini LED Sodering Void and crack Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree
Ispezione dell'inclinazione migliorata Sistema di ispezione a raggi X dei componenti MOSFET ad alta precisione AX8300 Unicomp Prestazioni stabili
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance The AX8300 X-ray inspection system is extensively deployed for circuit board and semiconductor inspection. As an offline X-ray solution, it is widely adopted in offline testing and defect analysis, ideal for PCBA, semiconductor packaging, ceramics, plastics, LED components and other precision electronic parts. System Summary Dimension 1215(W)∗1325(D)∗1700(H)mm
2.5D che intitola elettronica X Ray 40W rotazione a macchina 360° con un movimento di 6 assi
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point positioning system 130kV (Option 110KV) 7µm closed X-ray tube,
1uSv/h 0.5kW X da tavolino Ray Machine 5μm per i bordi di PCBA
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
5µm 0.5kW X Ray Detection Machine 1uSv/h per il laboratorio
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Features 90kV 5µm closed X-ray tube Max. loading area 235mm×205mm mm, max. inspection area 165mm×190mm, with 200X Magnification High resolution FPD with 3-axis motion system, meet basic inspection demands Navigation in windows, target
Macchina di raggi x offline di microfocus 5um AX8200B per ispezione di misalighment di bobina di bobina delle cellule di batteria al litio
Offline 5um microfocus X-ray machine AX8200B for Lithium Battery cell coil winding misalighment inspection The lithium battery X-Ray detection equipment of multiple types and full automation solely-developed by Unicomp Technology is targetted to inspect cells alignment metric and tabs soldering quality . It improves automation as well as gains high-definition internal images by means of X-ray imaging technology . This technology is widely applied to the detection of lithium
Macchina fotografica Unicomp X Ray 130kV di HD per l'ispezione dei bordi di PCBA
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
Ispezione interna di qualità di rilevazione di CNC di elettronica X Ray della palla da golf programmabile della macchina
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
