industrial x ray systems
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Monitor LCD del tunnel di Unicomp SMD PCBA X Ray Chip Counter 440mm
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
rivelatore di alta risoluzione di 5um 90KV Unicomp X Ray FPD per il cablaggio del cavo
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
Manipolatore di asse di Unicomp AX8200Max X Ray Machine 6 per ispezione programmabile di CNC
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
vuoti di 5um 90kV X Ray Scanner Machine Unicomp AX8200 MAX For SMT BGA QFN
90kV 5um microfocus Xray machine Unicomp AX8200MAX for SMT BGA QFN voids measurement with automatic inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
Attrezzatura in-linea di 160KV NDT X Ray Machine Radiography NDT per la ruota di alluminio
Unicomp Technology 160KV Inline NDT X-Ray Radiograpy system for aluminum wheel casting inspection Technical Data X-Ray Machine Dimensions:5430mmx2050mmx2410mm(L*W*H) Weight: 5T Detection range: 13~26" Load weight: 50KG Work environment: 5-40° ≦85﹪HR Install power: 380V±10％ 50HZ X-Ray Tube Voltage : 160KV Power: 800W/1800W Focal Spot Size: 0.5mm FPD Detector Detector Size: 250mm×300mm Pixel matrix: 1792mm*2176mm Pixel size: 139μm Frame rate: 9 fps(1x1)30 fps(2 x 2) Unicomp
5 ispezione automatica del tubo della radiografia di CNC 2D X Ray Machine Unicomp UNC225 di asse
5 Axis automatic CNC 2D X-Ray machine Unicomp UNC225 Radiography system for pipes welded seams quality testing Technical Dat Attribute Respective Value Maximum penetration(FE) 150mm/25mm Equipment weight 5T System Dimension 2230mm*1582mm*2478mm(L*W*H) X-ray Tube 225KV Power 640W/1600W Pixel Pitch 139μm Focal size 1.0mm/3.0mm Image Area 250mm x 300mm Non Destructive Testing (NDT) is an important part of industrial quality management. Much Digital Radiography (DR) standards
Alimento X Ray Detection Equipment di UNX4015N per metallo/vetro/controllo di pietra
UNX4015N Food X Ray Detection Equipment for Metal/Glass/Stone Checking Application UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Easy to Operate: one button start&stop, optional default product Provide High precision automatic foreign detection, It can
Sistema a raggi X Unicomp AX9100max per l'ispezione dei difetti interni dei componenti elettronici
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Sistema a raggi X AX9100max con algoritmi per la ricostruzione di immagini a superrisoluzione
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
