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Qualità Saldatura di Unicomp AX8500 X Ray Inspection Machine For SMT SME BGA LED CSP QFN Fabbrica

Saldatura di Unicomp AX8500 X Ray Inspection Machine For SMT SME BGA LED CSP QFN

Unicomp AX8500 X-ray inspection machine for SMT / EMS BGA LED CSP QFN soldering void measurement​ Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Qualità CNC di 5um SMT X Ray Equipment programmabile per i vuoti di SME BGA Fabbrica

CNC di 5um SMT X Ray Equipment programmabile per i vuoti di SME BGA

5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

Qualità Elettronica X Ray Machine 110kV Unicomp AX8500 di CSP SMT per SMT PCBA BGA QFN Fabbrica

Elettronica X Ray Machine 110kV Unicomp AX8500 di CSP SMT per SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

Qualità Chip AX8500 di CSP LED X Ray Machine Closed Tube Flip per il semiconduttore 100KV Fabbrica

Chip AX8500 di CSP LED X Ray Machine Closed Tube Flip per il semiconduttore 100KV

Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Qualità Ingrandimento Unicomp AX8500 di elettronica X Ray Machine FPD 1000X di SMT BGA Fabbrica

Ingrandimento Unicomp AX8500 di elettronica X Ray Machine FPD 1000X di SMT BGA

Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel

Qualità Attrezzatura di saldatura di ispezione di NDT di vuoto di elettronica X Ray Machine BGA QFN LED del PWB di SME SMT Fabbrica

Attrezzatura di saldatura di ispezione di NDT di vuoto di elettronica X Ray Machine BGA QFN LED del PWB di SME SMT

Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Application Fields of X Ray Machine AX8200Max SMT/PCBA Inspection Semiconductor Inspection Lithium Batteries Inspection LED Inspection Photovoltaic

Qualità 130KV Microfocus sorgente di raggi X per il rilevamento dei difetti interni della batteria al litio Fabbrica

130KV Microfocus sorgente di raggi X per il rilevamento dei difetti interni della batteria al litio

Unicomp 130kV Microfocus X Ray Source For EMS SMT PCBA BGA QFN X Ray Machine UNMS-U130B is a closed tube 130 kV Microfocus X-Ray Source using hot cathode technology, digital control and 100% domestic raw materials. It has the advantages of small focal spot size, high magnification, stable X-Ray emission, higher output power and strong penetration ability. The high voltage, control circuit and cooling unit are properly arranged within a compact space, with 24V DC power supply

Qualità Ispezione della batteria al litio con tubo a raggi X microfocus originale cinese Fabbrica

Ispezione della batteria al litio con tubo a raggi X microfocus originale cinese

Unicomp 130kV Microfocus X Ray Source For EMS SMT PCBA BGA QFN X Ray Machine UNMS-U130B is a closed tube 130 kV Microfocus X-Ray Source using hot cathode technology, digital control and 100% domestic raw materials. It has the advantages of small focal spot size, high magnification, stable X-Ray emission, higher output power and strong penetration ability. The high voltage, control circuit and cooling unit are properly arranged within a compact space, with 24V DC power supply

Qualità La macchina di alta risoluzione di elettronica X Ray, IC LED taglia il rivelatore dei componenti elettronici Fabbrica

La macchina di alta risoluzione di elettronica X Ray, IC LED taglia il rivelatore dei componenti elettronici

IC LED Clips Electronic Components Detector Electronics X Ray Machine X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray. (2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB