Macchina di elettronica X Ray
Macchina per raggi X con tubo sigillato Micro Focus 110kV IC AX8300 Unicomp 5μm ad alta precisione
High Precision IC AX8300 Unicomp 5μm Micro Focus 110kV Sealed Tube X-ray Machine The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration
Macchina per ispezione a raggi X ad alta precisione Unicomp AX8300 110kV sigillato tubo micro focus da 5μm per IC
Unicomp AX8300 High Precision X-ray Inspection Machine The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV equipment and
alta precisione AX8300 Unicomp dell'attrezzatura dei raggi X del micro fuoco della metropolitana sigillata 110kV
110kV Sealed Tube 5μm Micro Focus X-ray Equipment High Precision AX8300 Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of
Schede elettroniche ad alte prestazioni Macchina radiografica 2D 2.5D Unicomp AX9100MAX con tavola rotante a 360 gradi
High Specifications Electronic Boards 2D 2.5D X-ray Machine Unicomp AX9100MAX 130KV micron focus spot size tube X-ray machine Unicomp AX9100 with dual computers for PCB BGA inspection. Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages Fuses, power diodes, multilayer
Macchina a raggi X per tubi con dimensioni spot di messa a fuoco da 130KV micron Unicomp AX9100MAX con doppi computer per ispezione PCB BGA
Unicomp AX9100MAX X-Ray Inspection System 130KV micron focus spot size tube X-ray machine with dual computers for high-precision PCB and BGA inspection. Optimized for non-destructive testing of semiconductors and electronics, providing comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules,
Macchina a raggi X SMT PCB ad alta risoluzione con messa a fuoco in micron, dimensioni del punto Unicomp AX9100MAX per la misurazione dei vuoti BGA
SMT PCB X-ray Machine - Unicomp AX9100MAX High-resolution micron focus spot size X-ray system optimized for BGA voids measurement and comprehensive non-destructive testing of semiconductors and electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors, wiring harnesses, and photovoltaic components. System Specifications Footprint1450
Ispezione automatica programmabile CNC Macchina radiografica elettronica Unicomp AX9100MAX per la misurazione della curvatura IC
CNC Programmable Automatic Inspection Electronics X-ray Machine Unicomp AX9100MAX Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors,
Macchina a raggi X per PCB ad alte ingrandimenti Unicomp AX9100MAX per l'ispezione dei fili di legame dei componenti elettronici di IC
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery
Rilevazione rotativa Ingrandimento geometrico preciso Produzione di chip Raggi X UNICOMP AX9100 LED
UNICOMP AX9100 X-ray Inspection System Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 IC Inspection System Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with navigation mode detection 7 axis linkage with 70 degree tilt detection capability
