Macchina di elettronica X Ray
Progettazione Imballaggio interno Ispezione difetti Raggi X LED AX9100 UNICOMP Tester di produzione optoelettronica
AX9100 UNICOMP Optoelectronics Manufacturing Tester Advanced X-ray inspection system designed for internal packaging flaw detection in LED manufacturing and optoelectronics applications. Applications SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor and Packaging components Battery Industry and Electronic components Auto parts and Photovoltaic Industry Aluminum Die-casting and Moulding Plastic Ceramics and Other Special Industries Technical Specifications System
Rilevazione rotativa a pieno angolo Ingrandimento geometrico preciso Produzione di chip Raggi X UNICOMP AX9100
Full-angle Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 Advanced X-ray inspection system designed for precise geometric magnification and comprehensive chip production analysis with full-angle rotary detection capabilities. Applications SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor and Packaging components Battery Industry and Electronic components Auto parts and Photovoltaic Industry Aluminum Die-casting and Moulding Plastic
Apparecchiatura di collaudo per imballaggio di chip a semiconduttore UNICOMP AX9100 UNICOMP per raggi X di rottura del cavo di collegamento IC per imaging da 7μm
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with
Ispezione automatica batch CNC BGA Editmode X-ray AX9100 UNICOMP Elettronica Sistema di ispezione elaborazione PCBA
CNC Auto Batch Inspection BGA Editmode X-ray AX9100 UNICOMP Electronics PCBA Processing Inspection System Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1000X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function
Macchina per prove di componenti di precisione IC a raggi X AX9100 UNICOMP omnidirezionale per l'ispezione del filo di collegamento
Omni-directional Bond Wire Inspection IC X-ray AX9100 UNICOMP Precision Component Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with
Macchina per l'ispezione dei raggi X delle batterie al litio AX8300 Apparecchiatura per test dei difetti interni Unicomp
Lithium Battery X-ray Inspection Machine AX8300 The Unicomp AX8300 is a purpose-engineered offline micro-focus X-ray non-destructive testing system, specially optimized for high-precision quality control across PCBA, SMT assembly, semiconductor packaging and miniature electronic component manufacturing. Developed to fill the performance gap between mainstream 90kV and 130kV X-ray inspection equipment, it integrates Unicomp's proprietary self-developed 110kV sealed micro-focus
rivelatore di difetti del vuoto della macchina AX8300 Unicomp PTH di ispezione dei raggi X del foro passante placcato PCBA del punto del fuoco di 5μm
5μm Focus Spot PCBA Plated Through Hole X-ray Inspection Machine AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV
Macchina di ispezione a raggi X industriale 90KV AX7900 per vuoto di saldatura del cordone della lampada a LED e rottura del filo UNICOMP
90KV Industrial X-ray Inspection Machine AX7900 for LED Lamp Bead Solder Void and Wire Breakage UNICOMP Product Overview The AX7900 industrial X-ray inspection system features a high-performance 90kV X-ray tube with 5μm ultra-high resolution and a high-sensitivity FPD flat-panel detector. Built with a multifunctional precision workstation, the system includes standard multi-axis XY motion and supports optional ±60° tilting movement for flexible multi-angle inspection.
Macchina di ispezione industriale a raggi X 110KV per analisi di svuotamento della saldatura IGBT UNICOMP AX8300MAX
110KV Industrial X-ray Inspection Machine for IGBT Solder Voiding Analysis UNICOMP AX8300MAX This advanced industrial X-ray inspection system is specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive
