Macchina di elettronica X Ray
Apparecchiatura di collaudo per imballaggio di chip a semiconduttore UNICOMP AX9100 UNICOMP per raggi X di rottura del cavo di collegamento IC per imaging da 7μm
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & ...
Rilevazione rotativa Ingrandimento geometrico preciso Produzione di chip Raggi X UNICOMP AX9100 LED
UNICOMP AX9100 X-ray Inspection System Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 IC Inspection System Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time ...
Macchina a raggi X per PCB ad alte ingrandimenti Unicomp AX9100MAX per l'ispezione dei fili di legame dei componenti elettronici di IC
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive ...
Ispezione automatica programmabile CNC Macchina radiografica elettronica Unicomp AX9100MAX per la misurazione della curvatura IC
CNC Programmable Automatic Inspection Electronics X-ray Machine Unicomp AX9100MAX Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. ...
Macchina a raggi X SMT PCB ad alta risoluzione con messa a fuoco in micron, dimensioni del punto Unicomp AX9100MAX per la misurazione dei vuoti BGA
SMT PCB X-ray Machine - Unicomp AX9100MAX High-resolution micron focus spot size X-ray system optimized for BGA voids measurement and comprehensive non-destructive testing of semiconductors and electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer ...
Macchina a raggi X per tubi con dimensioni spot di messa a fuoco da 130KV micron Unicomp AX9100MAX con doppi computer per ispezione PCB BGA
Unicomp AX9100MAX X-Ray Inspection System 130KV micron focus spot size tube X-ray machine with dual computers for high-precision PCB and BGA inspection. Optimized for non-destructive testing of semiconductors and electronics, providing comprehensive inspection capabilities for IC curvature ...
Schede elettroniche ad alte prestazioni Macchina radiografica 2D 2.5D Unicomp AX9100MAX con tavola rotante a 360 gradi
High Specifications Electronic Boards 2D 2.5D X-ray Machine Unicomp AX9100MAX 130KV micron focus spot size tube X-ray machine Unicomp AX9100 with dual computers for PCB BGA inspection. Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides ...
Apparecchiatura a raggi X Unicomp AX8300 per il controllo qualità Rilevamento automatico di vuoti BGA ad alta precisione di movimento
Unicomp AX8300 X-ray Inspection System The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT, and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it provides balanced ...
Sistema di controllo qualità dei raggi X per giunti di saldatura BGA ad alta precisione AX8300 Attrezzatura Unicomp
High Precision BGA Solder Joint X-ray Quality Control System AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray ...
