X dispositivo d'esplorazione di sicurezza del raggio
Apparecchiatura di test per assemblaggio SMT Unicomp X-ray AX7900 BGA ad alta risoluzione AI per PCBA
Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of X-Ray machine AX7900: Adopts high-performance 90kV micro-focus X-ray tube with 5μm focal spot and high-sensitivity FPD flat panel detector. Built with precision multi-axis XY motion platform, optional ±60° oblique viewing angle is available. Independent Z-axis adjustment for X-ray source and detector freely optimizes imaging magnification and detection field range.Precise optical point
Unicomp UNX4015N ispeziona pietre metalliche per mangimi avicoli con tecnologia di apprendimento AI
Unicomp UNX4015N Food And Beverage X Ray 480W For Packed Food Technical Specifications of Food Xray machine Equipment Features Dimension 1140(W)X1160(D)X1975(H)mm Machine weight 450kg X-ray tube 80-120kv/210-480W Power Supply AC 220V, 50Hz X-ray detector Diode array with 0.4mm resolution Channel size 400mm(W)*150mm(H) Conveyor Speed 10-70M/min Heavy load Conveyor Speed 10-40M/min Operating Range 5°C to 40°C (50°F to 104°F),30% to 90% relative humidity non-condensing C
Unicomp AX9600 160KV tubo aperto 2.5D raggi X per TVS diodo interno ad alta precisione
Unicomp High-end Semiconductor X-Ray Inspection System AX9600 UNICOMP AX9600 features a self-developed 160kV high-power open micro-focus X-ray tube, delivering an ultra-small 0.8μm focal spot. With exceptional magnification up to 2000 times and outstanding ray penetration capacity, it accurately measures void ratio of TVS diodes, and is ideal for high-precision quality inspection of advanced IC packaging, HBM memory chips and GPU semiconductor components. Specifications:
Alta Precisione di Movimento Tubo Sigillato da 90kV Componente Semiconduttore MOSFET Apparecchiatura a Raggi X AX7900 Controllo Qualità Unicomp
Electronic Semiconductor X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is an advanced micro-focus X-ray NDT system manufactured by UNICOMP Technology.It delivers ultra-clear internal defect imaging for semiconductor packaging, SMT assembly and electronic component quality inspection.Adopting independently manufactured X-ray tubes and professional image analysis software, it effectively inspects solder voids, welding defects, PCB internal layers, battery cells and precision
Macchina di ispezione elettronica a raggi X AX7900 Unicomp 5μm Micro Focus Auto Void Detection BGA Solder High Precision
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
