x ray inspection system
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Parti industriali di 160KV NDT X Ray Machine For Aluminum Casting
160KV Industrial NDT X Ray Machine For Aluminum Casting Parts Unicomp industrial X-ray NDT inspection equipment for Aluminum casting parts qualtiy control with AI Algorithm Technical Data of UNC160s Attribute Respective Value Sample Dimensions Outer width: 250 [mm] max. Outer diameter: 550 [mm] max. Maximum Sample Weight 15 [kg] System Dimension 1480mm*1106mm*2038mm(L*W*H) X-ray Tube 160 [kV] Detector Active Area 250*550mm Pixel Pitch 139 [m] Maximum penetration(AL) 100mm
vista obliqua della metropolitana AX9100 Unicomp X Ray Machine FPD di fine 5um per ispezione di IC Semicon
Unicomp 5μm close tube AX9100 X-ray machine with FPD oblique view for IC Semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
Ispezione legante di spazzata di elettronica X Ray Machine For Semiconductor Wire di AX9100 130kV
High Resolution of 130kV AX9100 X-ray for Semiconductor wire bonding sweep inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
Macchina di elettronica X Ray di CX3000 Benchtop per BGA, CSP, il LED & il semiconduttore
CX3000 Benchtop Electronics X Ray Machine for BGA , CSP , LED & Semiconductor X ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. X ray Inspecting Features: (1) Coverage of process defects up to 97%.
Macchina in-linea su misura di NDT X Ray
Customized Inline Universal Industrial Quality Inspection NDT X Ray Equipment Unicomp Technology listen to customers’ requirements and build efficient cost affective machines for real-world applications. From the single sample lab environment to the production floor Unicomp builds a variety of machines to cover your needs. Unicomp has developed the UNC series of cabinet x-ray inspection systems to address specific applications. Most Unicomp x-ray systems have the ability to
Attrezzatura altamente flessibile dell'esame di X Ray per elettronica ed il semiconduttore
Highly flexible and cost effective electronics and semiconductor X Ray Machine X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. X-ray Inspecting Features: (1) Coverage of process defects up to 97%.
Attrezzatura 220AC/50Hz dei raggi x di Unicomp del Governo con il sistema di elaborazione di immagini di DXI
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Sistema di ispezione a raggi X multifunzione microfocus CX3000 da tavolo per l'ispezione di componenti elettronici falsi
Desk-top Multi-function microfocus CX3000 X-ray Inspection System for electronic components fake inspection Specification Of X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x
Rilevazione in tempo reale dei difetti delle parti di NDT X Ray Equipment For Small Casting di rappresentazione
Real Time Imaging NDT X Ray Equipment For Small Casting Parts Flaws Detection Factory directly supply of Real-time Imaging NDT X-ray Equipment for Small Casting parts flaws detection Technical Data of NDT X-Ray machine Attribute Respective Value Sample Dimensions Outer width: 250 [mm] max. Outer diameter: 550 [mm] max. Maximum Sample Weight 15 [kg] System Dimension 1480mm*1106mm*2038mm(L*W*H) X-ray Tube 160 [kV] Detector Active Area 250*550mm Pixel Pitch 139 [m] Maximum
